The core technology comes from the company's 20 years of technological accumulation and packaging technology accumulation

The process platform includes power device packaging and IC device packaging.

The company has 97 sets of main packaging and testing equipment; We have a platform for hot solder and dot paste cored processes, as well as a platform for copper and aluminum wire processes; The packaging has a complete series of SOP8, ESOP8, and TO; Having a mature management and technical research and development team; Having a foundation in the operation of the ISO9001 quality system for many years; Mature market sales channels cover high and low voltage VDMOSFET, COOLMOSFET, SBD, FRD, Power Transformer, IC, IGBT, SiCMOS And other series of products.

The company's business has developed into an IDM company with chip design, wafer manufacturing, packaging testing, and the production of its own brand of power devices。